We specialize in designing high-performance, complex system boards, bridging the gap between chip architecture and robust product realization through expert layout, rigorous simulation, and seamless transition to manufacturing.
We engineer cutting-edge digital boards optimized for performance, flexibility, and cost efficiency, capable of handling the most demanding silicon interfaces.
Complex PCB Architecture:
Development of advanced boards, ranging from 2 to 30 layer stack ups, capable of supporting fine component pitches greater than 0.4mm.
System Optimization:
Expertise in refining system-level requirements based on performance, power, and environmental constraints, choosing control and data path designs that ensure debuggability and programmability.
Full Hardware Ecosystem:
Deep experience in designing and integrating evaluation boards, high-speed interfaces, package designs, and clocking solutions necessary for both product integration and post-silicon testing
We guarantee the physical integrity and electrical performance of your board design through meticulous analysis and rigorous simulation prior to fabrication.
Advanced Design Tools:
Utilization of industry-standard Electronic Design Automation (EDA) tools like Cadence Allegro, OrCAD, and Altium for detailed schematic and layout design.
Signal Integrity Assurance:
Comprehensive simulation and verification covering Signal Integrity (SI) and Power Integrity (PI), ensuring that electrical characteristics meet design specifications and correlate accurately to functional use cases.
Design for Manufacturing (DFx):
Focus on maximizing production yield and quality through adherence to Design for Manufacturing (DFM) and Design for Testability (DFT) requirements.
We provide full-lifecycle design and deployment of systems built around FPGAs, delivering hardened, high-performance computing platforms for specialized applications.
Custom Logic Development:
Providing full ASIC / FPGA Architecture & Development services, implementing core digital logic and optimizing the data path design for efficiency and flexibility.
System Integration:
Design and implementation of the hosting PCB (up to 30 layers) that connects the FPGA to high-speed digital interfaces and complex components, optimized for system-level cost and performance requirements.
Embedded Deployment:
Seamless integration of FPGA hardware with necessary BSP, firmware, and embedded drivers, ensuring the system is ready for domain-specific deployment (e.g., Industrial, Automotive, or AI acceleration).
We ensure a reliable path from initial design concept (PRD) to qualified mass production through structured validation and robust manufacturing management.
Structured Development Flow:
Execution of the complete System Design Production Flow, including Rev A Prototype Build, followed by EVT (Engineering Validation Testing) and corner testing.
Compliance and Qualification:
Detailed design validation, including EMI/EMC pre-scan tests, leading to final qualification and regulatory testing/certification.
Volume Production Readiness:
Management of the manufacturing process using established quality protocols with EMS partners, covering SMT lines, Automated Optical Inspection (AOI), and X-Ray Inspection, supporting high-mix/mid-volume (10K to 500K annual volumes)
