Eximietas News And Events
Semiconductor 3D Packaging
We need bigger and faster devices to manage more complex and larger amounts of data. As data evolves, the amount…
Known good die - Wafer Probe Testing
Wafer testing has long been used to evaluate bare dies that are still part of the wafer. This process allows…
Challenges of building nextgen chiplets
There has been a lot of discussion lately about hardware required to meet the needs of training and inferencing of…
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Eximietas Design Acquires R2M2
Posted by EximietasOctober 8, 2023
Eximietas Design Acquires R2M2 to Bolster DevOps Expertise and Accelerate Cloud Adoption. San Jose, CA…