Post-Silicon Validation & Characterization

We provide end-to-end silicon validation, debugging, and characterization services focused on accelerating time-to-market. Our methodology emphasizes achieving high Reliability, Availability, and Serviceability (RAS) and correlating Automated Test Equipment (ATE) results to real-world use cases.

 Silicon & Board Bring up Read More →

Functional, Feature & Stress Validation Read More →

 Performance, Power & Thermal Characterization Read More →

IO/Interface Validation Read More →

1

Silicon & Board Bring up

This phase ensures the foundational integrity of new silicon, enabling rapid transition to detailed validation.

  • Rapid Time-to-Market: Expedited initial Power-Up and Boot-Up Sequence Verification.
  • Foundational Integrity: Execution of Basic Integrity Checks on Power, Clocks, Frequency, and Voltages.
  • Comprehensive Preparation: Development and deployment of Evaluation Boards, Firmware, and Boot Support Packages (BSPs) to achieve operational silicon status swiftly.
2

Functional, Feature & Stress Validation

We guarantee the system's robustness and functional correctness across all operational boundaries using advanced automation techniques.

  • Core Logic & Subsystem Validation: Rigorous functional testing of core blocks (CPU, GPU, VPU, DMAC) and complex sub-systems (memory, storage, IO).
  • Automation Excellence: Achieving high functional coverage through fully automated test suites.
  • AI-Enhanced Testing: Leveraging Agentic AI-assisted test case generation to improve coverage and efficacy.
  • System Robustness: Intensive Stress & Stability testing (e.g., Temperature endurance, CPU/GPU stress) under extreme failure scenarios.
3

Performance, Power & Thermal Characterization

Defining stable operating limits is crucial for maximizing yield and product stability in production environments.

  • PVT Characterization: Establishing performance baselines via PVT (Process, Voltage, Temperature) corner testing to define operational limits and recommended operating conditions.
  • Electrical & Power Analysis: Performing Static & Dynamic Electrical Measurements, Signal Integrity (SI), Power Integrity (PI), and PnP (Power and Performance) Measurements.
  • Thermal Management: Comprehensive Thermal Characterization to ensure power consumption and heat dissipation meet specifications across various corners.
4

IO/Interface Validation

We guarantee connectivity compliance and maximum data throughput across high-speed and low-speed interfaces.

  • High-Speed Connectivity: Specialized validation for high-speed interfaces like PCIe, CXL, DDR, UFS, and MIPI.
  • Signal Integrity Guarantee: Deep analysis using Eye Diagram Monitoring for Signal Integrity (SI) and Bit Error Rate (BER) measurement.
  • Protocol Compliance: Rigorous protocol compliance testing for both high-speed and low-speed interfaces (I2C/SPI/UART, Ethernet, etc.) to ensure adherence to industry standards.